جستجوی داغ M323R8GA3PB0-CTD 900-13636-0010-000 ARDUINO SHIELD SGPC3_SHTC3 ADG452BRUZ AD8630ARUZ RF50S MT25QU01GBBB8E12-0AUT MT53E256M32D2DS-053 AUT:B GS4981-IDA ICM-20948

در دسترس ۲۴/۷ در

+86 13632816717

خانه > محصولات > اتصال دهنده ها، اتصال دهنده ها > سوکت برای آی سی، ترانزیستور > سوکت های آی سی

سوکت های آی سی

شماره قطعه تولیدکننده	موجودی	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
4818-3000-CP CONN IC DIP SOCKET 18POS TIN 3M	756	-	RFQ	برگه مشخصات	4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
08-3518-10T CONN IC DIP SOCKET 8POS GOLD Aries Electronics	579	-	RFQ	برگه مشخصات	518	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
ICM-324-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 24P Adam Tech	215	-	RFQ	برگه مشخصات	ICM	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
SA183000 CONN IC DIP SOCKET 18POS GOLD On Shore Technology Inc.	769	-	RFQ	برگه مشخصات	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
06-0518-10 CONN SOCKET SIP 6POS GOLD Aries Electronics	717	-	RFQ	برگه مشخصات	518	Bulk	Active	SIP	6 (1 x 6)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
ICM-628-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 28P Adam Tech	706	-	RFQ	برگه مشخصات	ICM	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
A-CCS 028-Z-SM CONN SOCKET PLCC 28POS TIN Assmann WSW Components	77	-	RFQ	برگه مشخصات	-	Tube	Active	PLCC	28 (4 x 7)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polyamide (PA9T), Nylon 9T, Glass Filled	-40°C ~ 105°C
917-47-108-41-005000 CONN SOCKET TRANSIST TO-5 8POS Mill-Max Manufacturing Corp.	87	-	RFQ	برگه مشخصات	917	Tube	Active	Transistor, TO-5	8 (Round)	-	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
917-47-210-41-005000 CONN SOCKET TRANSIST TO-5 10POS Mill-Max Manufacturing Corp.	31	-	RFQ	برگه مشخصات	917	Tube	Active	Transistor, TO-100	10 (Round)	-	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-43-308-10-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	55	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4), 4 Loaded	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICA-308-SGT CONN IC DIP SOCKET 8POS GOLD Samtec Inc.	79	-	RFQ	برگه مشخصات	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Brass	Polyester, Glass Filled	-55°C ~ 125°C
XR2A-1611-N CONN IC DIP SOCKET 16POS GOLD Omron Electronics Inc-EMC Div	49	-	RFQ	برگه مشخصات	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
110-13-318-41-001000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	90	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-13-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	99	-	RFQ	برگه مشخصات	123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-13-624-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	48	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-99-964-41-001000 CONN IC DIP SOCKET 64POS TINLEAD Mill-Max Manufacturing Corp.	95	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-47-964-41-001000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	42	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
40-0518-11 CONN SOCKET SIP 40POS GOLD Aries Electronics	85	-	RFQ	برگه مشخصات	518	Bulk	Active	SIP	40 (1 x 40)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
24-526-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	62	-	RFQ	برگه مشخصات	Lo-PRO®file, 526	Bulk	Active	DIP, ZIF (ZIP)	24 (2 x 12)	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
24-6554-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	63	-	RFQ	برگه مشخصات	55	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-

Total 19086 Record«Prev 1... 49 50 51 525354 55 56...955 Next»

همین حالا شروع کنید!

دریافت آخرین اخبار

خانه

جستجو

محصولات

[email protected]

+86 13632816717