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خانه > محصولات > اتصال دهنده ها، اتصال دهنده ها > سوکت برای آی سی، ترانزیستور > سوکت های آی سی

سوکت های آی سی

شماره قطعه تولیدکننده	موجودی	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
251-5949-02-0602 CONN ZIG-ZAG ZIF 51POS GOLD 3M	13	-	RFQ	برگه مشخصات	Textool™	Bulk	Active	Zig-Zag, ZIF (ZIP)	51 (1 x 25, 1 x 26)	0.050" (1.27mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
361-PRS19001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	16	-	RFQ	برگه مشخصات	PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
248-4205-01 CONN SOCKET QFN 48POS GOLD 3M	14	-	RFQ	برگه مشخصات	Textool™	Bulk	Active	QFN	48 (4 x 12)	0.016" (0.40mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
256-4205-01 CONN SOCKET QFN 56POS GOLD 3M	8	-	RFQ	برگه مشخصات	Textool™	Bulk	Active	QFN	56 (4 x 14)	0.016" (0.40mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.016" (0.40mm)	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
280-5205-01 CONN SOCKET QFN 80POS GOLD 3M	10	-	RFQ	برگه مشخصات	Textool™	Bulk	Active	QFN	80 (4 x 20)	0.020" (0.50mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.020" (0.50mm)	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
44-547-11E CONN SOCKET SOIC ZIF 44POS GOLD Aries Electronics	10	-	RFQ	برگه مشخصات	547	Bulk	Active	SOIC, ZIF (ZIP)	44 (2 x 22)	-	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
110-47-306-41-001000 CONN IC DIP SOCKET 6POS GOLD Mill-Max Manufacturing Corp.	373	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ED020PLCZ CONN SOCKET PLCC 20POS TIN On Shore Technology Inc.	663	-	RFQ	برگه مشخصات	ED	Tube	Active	PLCC	20 (4 x 5)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 105°C
210-47-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	785	-	RFQ	برگه مشخصات	210	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
EDO-32PLCZSM CONN SOCKET PLCC 32POS On Shore Technology Inc.	712	-	RFQ	برگه مشخصات	ED	Tube	Active	PLCC	32 (2 x 16)	0.050" (1.27mm)	-	-	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	-	-	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 105°C
111-47-306-41-001000 CONN IC DIP SOCKET 6POS GOLD Mill-Max Manufacturing Corp.	408	-	RFQ	برگه مشخصات	111	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-47-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	377	-	RFQ	برگه مشخصات	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
06-0518-10H CONN SOCKET SIP 6POS GOLD Aries Electronics	93	-	RFQ	برگه مشخصات	518	Bulk	Active	SIP	6 (1 x 6)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
8432-21A1-RK-TP CONN SOCKET PLCC 32POS TIN 3M	78	-	RFQ	برگه مشخصات	8400	Tube	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
SA486000 CONN IC DIP SOCKET 48POS GOLD On Shore Technology Inc.	33	-	RFQ	برگه مشخصات	SA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
115-43-314-41-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	38	-	RFQ	برگه مشخصات	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-43-210-41-006000 CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp.	78	-	RFQ	برگه مشخصات	116	Tube	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
ICA-320-STT CONN IC DIP SKT 20POS Samtec Inc.	36	-	RFQ	برگه مشخصات	ICA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
32-6518-10 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	89	-	RFQ	برگه مشخصات	518	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
ICF-318-T-O CONN IC DIP SOCKET 18POS TIN Samtec Inc.	27	-	RFQ	برگه مشخصات	ICF	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C

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