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خانه > محصولات > اتصال دهنده ها، اتصال دهنده ها > سوکت برای آی سی، ترانزیستور > سوکت های آی سی

سوکت های آی سی

شماره قطعه تولیدکننده	موجودی	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
299-43-312-10-001000 CONN IC DIP SOCKET 12POS GOLD Mill-Max Manufacturing Corp.	3	-	RFQ	برگه مشخصات	299	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
28-C182-10 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	0	-	RFQ	برگه مشخصات	EJECT-A-DIP™	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
110-43-628-41-801000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	6	-	RFQ	برگه مشخصات	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
12-823-90C CONN IC DIP SOCKET 12POS GOLD Aries Electronics	2	-	RFQ	برگه مشخصات	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
40-6554-10 CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics	0	-	RFQ	برگه مشخصات	55	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
220-3342-00-0602J CONN IC DIP SOCKET ZIF 20POS GLD 3M	0	-	RFQ	برگه مشخصات	Textool™	Tube	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
240-1280-00-0602J CONN IC DIP SOCKET ZIF 40POS GLD 3M	0	-	RFQ	برگه مشخصات	Textool™	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
169-PRS13001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	1	-	RFQ	برگه مشخصات	PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
232-5205-01 CONN SOCKET QFN 32POS GOLD 3M	0	-	RFQ	برگه مشخصات	Textool™	Bulk	Active	QFN	32 (4 x 8)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
A 16-LC-TT CONN IC DIP SOCKET 16POS TIN Assmann WSW Components	0	-	RFQ	برگه مشخصات	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
A 28-LC-TR CONN IC DIP SOCKET 28POS TIN Assmann WSW Components	0	-	RFQ	برگه مشخصات	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
A 06-LC-TT CONN IC DIP SOCKET 6POS TIN Assmann WSW Components	0	-	RFQ	برگه مشخصات	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
D01-9970442 CONN SOCKET SIP 4POS GOLD Harwin Inc.	0	-	RFQ	برگه مشخصات	D01-997	Tube	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AR 24-HZL-TT CONN IC DIP SOCKET 24POS TIN Assmann WSW Components	5	-	RFQ	برگه مشخصات	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
SA163040 CONN IC DIP SOCKET 16POS GOLD On Shore Technology Inc.	0	-	RFQ	برگه مشخصات	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	80.0µin (2.03µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
A-CCS 020-Z-SM CONN SOCKET PLCC 20POS TIN Assmann WSW Components	0	-	RFQ	برگه مشخصات	-	Tube	Active	PLCC	20 (4 x 5)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polyamide (PA9T), Nylon 9T, Glass Filled	-40°C ~ 105°C
PLCC-28-AT PLCC 28P THROUGH HOLE Adam Tech	0	-	RFQ	برگه مشخصات	PLCC	Tube	Active	PLCC	28 (4 x 7)	0.050" (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
SA246000 CONN IC DIP SOCKET 24POS GOLD On Shore Technology Inc.	7	-	RFQ	برگه مشخصات	SA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
SA243040 CONN IC DIP SOCKET 24POS GOLD On Shore Technology Inc.	0	-	RFQ	برگه مشخصات	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	80.0µin (2.03µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
AR 08-HZW/TN CONN IC DIP SOCKET 8POS GOLD Assmann WSW Components	0	-	RFQ	برگه مشخصات	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C

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