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خانه > محصولات > اتصال دهنده ها، اتصال دهنده ها > سوکت برای آی سی، ترانزیستور > سوکت های آی سی

سوکت های آی سی

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
APH-0624-G-H APH-0624-G-H Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0224-G-H APH-0224-G-H Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1624-G-H APH-1624-G-H Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0724-G-H APH-0724-G-H Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1724-G-H APH-1724-G-H Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
40-9503-21 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	503	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
40-9503-31 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	503	Bulk	Active	DIP, 0.9" (22.86mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
510-41-144-15-082001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	510	Bulk	Active	PGA	144 (15 x 15)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-43-652-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	-	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
116-93-652-61-007000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	-	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	52 (2 x 26)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
111-93-964-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	-	111	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
7100265148 TEXTOOLRECEPTACLES FOR DIP SOCKE 3M	-	RFQ	-	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-648-61-008000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	-	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
122-13-964-41-001000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	122	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
323-13-164-41-001000 SOCKET 3 LEVEL WRAPOST SIP 64POS Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	323	Tube	Active	SIP	64 (1 x 64)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
517-87-599-54-131111 CONN SOCKET PGA 599POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	517	Bulk	Active	PGA	599 (54 x 54)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-93-642-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	-	116	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
40-6508-212 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
40-6508-312 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
116-43-950-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	-	116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C