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خانه > محصولات > اتصال دهنده ها، اتصال دهنده ها > سوکت برای آی سی، ترانزیستور > سوکت های آی سی

سوکت های آی سی

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
116-93-950-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	-	116	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	50 (2 x 25)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
123-11-964-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	123	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
36-3571-11 CONN IC DIP SOCKET ZIF 36POS GLD Aries Electronics	-	RFQ	برگه مشخصات	57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
36-3572-11 CONN IC DIP SOCKET ZIF 36POS GLD Aries Electronics	-	RFQ	برگه مشخصات	57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
36-3573-11 CONN IC DIP SOCKET ZIF 36POS GLD Aries Electronics	-	RFQ	برگه مشخصات	57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
36-3574-11 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	-	RFQ	برگه مشخصات	57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
36-6571-11 CONN IC DIP SOCKET ZIF 36POS GLD Aries Electronics	-	RFQ	برگه مشخصات	57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
36-6572-11 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	-	RFQ	برگه مشخصات	57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
36-6575-11 CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics	-	RFQ	برگه مشخصات	57	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-
510-93-114-13-062002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	510	Bulk	Active	PGA	114 (13 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
510-93-114-13-062003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	-	RFQ	برگه مشخصات	510	Bulk	Active	PGA	114 (13 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
32-6508-21 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
32-6508-31 CONN IC DIP SOCKET 32POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	508	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 125°C
546-87-320-19-131147 CONN SOCKET PGA 320POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	546	Bulk	Active	PGA	320 (19 x 19)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
APH-1834-G-T APH-1834-G-T Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0934-G-T APH-0934-G-T Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1534-G-T APH-1534-G-T Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-1934-G-T APH-1934-G-T Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0734-G-T APH-0734-G-T Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APH-0234-G-T APH-0234-G-T Samtec Inc.	-	RFQ	-	*	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-