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عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
42-3553-16

42-3553-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

0
RFQ
42-3553-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6551-16

42-6551-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

0
RFQ
42-6551-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6552-16

42-6552-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

0
RFQ
42-6552-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6553-16

42-6553-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

0
RFQ
42-6553-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6554-16

42-6554-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

0
RFQ
42-6554-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
558-10-504M29-001101

558-10-504M29-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0
RFQ
558-10-504M29-001101

برگه مشخصات

558 Bulk Active PGA 504 (29 x 29) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
163-PGM15066-10T

163-PGM15066-10T

CONN SOCKET PGA TIN

Aries Electronics

0
RFQ
163-PGM15066-10T

برگه مشخصات

PGM Bulk Active PGA - 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
163-PGM15067-10T

163-PGM15067-10T

CONN SOCKET PGA TIN

Aries Electronics

0
RFQ
163-PGM15067-10T

برگه مشخصات

PGM Bulk Active PGA - 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
64-PRS16016-12

64-PRS16016-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
64-PRS16016-12

برگه مشخصات

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
101-PLS14030-12

101-PLS14030-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
101-PLS14030-12

برگه مشخصات

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
HLS-0820-G-38

HLS-0820-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0820-G-38

برگه مشخصات

HLS Bulk Active SIP 160 (8 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
558-10-478M26-131104

558-10-478M26-131104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0
RFQ
558-10-478M26-131104

برگه مشخصات

558 Bulk Active BGA 478 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Open Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
44-PLS12017-12

44-PLS12017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
44-PLS12017-12

برگه مشخصات

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
44-PRS12017-12

44-PRS12017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
44-PRS12017-12

برگه مشخصات

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
100-PLS10001-12

100-PLS10001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
100-PLS10001-12

برگه مشخصات

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
518-77-478M26-131105

518-77-478M26-131105

CONN SOCKET PGA 478POS GOLD

Preci-Dip

0
RFQ
518-77-478M26-131105

برگه مشخصات

518 Bulk Active PGA 478 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-480M29-001104

558-10-480M29-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0
RFQ
558-10-480M29-001104

برگه مشخصات

558 Bulk Active BGA 480 (29 x 29) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
144-PRS13095-12

144-PRS13095-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
144-PRS13095-12

برگه مشخصات

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
514-83-576M30-001148

514-83-576M30-001148

CONN SOCKET BGA 576POS GOLD

Preci-Dip

0
RFQ
514-83-576M30-001148

برگه مشخصات

514 Bulk Active BGA 576 (30 x 30) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
518-77-480M29-001105

518-77-480M29-001105

CONN SOCKET PGA 480POS GOLD

Preci-Dip

0
RFQ
518-77-480M29-001105

برگه مشخصات

518 Bulk Active PGA 480 (29 x 29) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
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