لطفاً برای دریافت آخرین قیمت‌ها و موجودی با ما تماس بگیرید.

سوکت های آی سی

عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
108-PRS12024-12

108-PRS12024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
108-PRS12024-12

برگه مشخصات

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
108-PRS13129-12

108-PRS13129-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
108-PRS13129-12

برگه مشخصات

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
2256-9020-00-2401

2256-9020-00-2401

3M TEXTOOL 2256-9020-00-2401 PP1

3M

0
RFQ

-

Textool™ Bulk Obsolete - - - - - - - - - - - - - - -
48-3551-16

48-3551-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

0
RFQ
48-3551-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-3552-16

48-3552-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

0
RFQ
48-3552-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-3553-16

48-3553-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

0
RFQ
48-3553-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6551-16

48-6551-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

0
RFQ
48-6551-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6552-16

48-6552-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

0
RFQ
48-6552-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6553-16

48-6553-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

0
RFQ
48-6553-16

برگه مشخصات

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
518-77-500M30-001106

518-77-500M30-001106

CONN SOCKET PGA 500POS GOLD

Preci-Dip

0
RFQ
518-77-500M30-001106

برگه مشخصات

518 Bulk Active PGA 500 (30 x 30) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
550-10-576M30-001152

550-10-576M30-001152

BGA SOLDER TAIL

Preci-Dip

0
RFQ
550-10-576M30-001152

برگه مشخصات

550 Bulk Active BGA 576 (30 x 30) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
518-77-504M29-001106

518-77-504M29-001106

CONN SOCKET PGA 504POS GOLD

Preci-Dip

0
RFQ
518-77-504M29-001106

برگه مشخصات

518 Bulk Active PGA 504 (29 x 29) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
235-3019-01-0602

235-3019-01-0602

CONN ZIG-ZAG ZIF 35POS GOLD

3M

0
RFQ
235-3019-01-0602

برگه مشخصات

Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
558-10-520M31-001104

558-10-520M31-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0
RFQ
558-10-520M31-001104

برگه مشخصات

558 Bulk Active BGA 520 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
44-6570-16

44-6570-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

0
RFQ
44-6570-16

برگه مشخصات

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
518-77-520M31-001105

518-77-520M31-001105

CONN SOCKET PGA 520POS GOLD

Preci-Dip

0
RFQ
518-77-520M31-001105

برگه مشخصات

518 Bulk Active PGA 520 (31 x 31) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
120-PLS13015-12

120-PLS13015-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
120-PLS13015-12

برگه مشخصات

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
120-PRS13015-12

120-PRS13015-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
120-PRS13015-12

برگه مشخصات

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
24-3551-18

24-3551-18

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
47-PLS16021-12

47-PLS16021-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
47-PLS16021-12

برگه مشخصات

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
Total 19086 Record«Prev1... 900901902903904905906907...955Next»

همین حالا شروع کنید!

دریافت آخرین اخبار

EASTECH Electronics

خانه

EASTECH Electronics

جستجو

EASTECH Electronics

محصولات

EASTECH Electronics

Whatsapp

در حال ارسال...
×
با موفقیت ارسال شد!
از ارسال شما سپاسگزاریم، تیم فروش ما درخواست شما را دریافت خواهد کرد و ظرف ۱۲ ساعت با ارائه قیمت با شما تماس خواهیم گرفت.