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خانه > محصولات > فن ها، دمنده ها، مدیریت حرارتی > حرارتی > سینک های حرارتی

سینک های حرارتی

شماره قطعه تولیدکننده	موجودی	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	بسته خنک شده	روش پیوست	شکل	طول	عرض	قطر	ارتفاع باله	اتلاف نیرو @ افزایش دما	مقاومت حرارتی @ جریان هوای اجباری	مقاومت حرارتی @ طبیعی	مواد	پایان مواد
507302B00000G HEATSINK TO-220 2.5W LOW PROFILE Boyd Laconia, LLC	31,204	-	RFQ	برگه مشخصات	-	Bulk	Active	Board Level	TO-220	Bolt On	Square, Fins	0.750" (19.05mm)	0.750" (19.05mm)	-	0.380" (9.65mm)	2.5W @ 60°C	10.00°C/W @ 200 LFM	24.00°C/W	Aluminum	Black Anodized
574502B00000G HEATSINK TO-220 VERT MNT .75" Boyd Laconia, LLC	39,642	-	RFQ	برگه مشخصات	-	Bag	Active	Board Level	TO-220	Clip	Rectangular, Fins	0.750" (19.05mm)	0.860" (21.84mm)	-	0.395" (10.03mm)	3.0W @ 60°C	8.00°C/W @ 400 LFM	21.20°C/W	Aluminum	Black Anodized
290-1AB HEATSINK TO-220 VERT/HORZ BLK Wakefield-Vette	4,488	-	RFQ	برگه مشخصات	290	Bulk	Active	Board Level	TO-218, TO-202, TO-220	Bolt On	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	2.0W @ 44°C	7.00°C/W @ 400 LFM	22.00°C/W	Aluminum	Black Anodized
V-1100-SMD/B-L HEAT SINK COPPER DPAK TO-252 Assmann WSW Components	6,405	-	RFQ	برگه مشخصات	-	Bulk	Active	Top Mount	TO-252 (DPak)	SMD Pad	Rectangular, Fins	0.320" (8.13mm)	0.790" (20.07mm)	-	0.390" (9.91mm)	-	-	25.00°C/W	Copper	Tin
V-1100-SMD/A-L HEATSINK TO-263 12.70X26.20MM Assmann WSW Components	4,987	-	RFQ	برگه مشخصات	-	Bulk	Active	Top Mount	TO-263 (D²Pak)	SMD Pad	Rectangular, Fins	0.500" (12.70mm)	1.031" (26.20mm)	-	0.390" (9.91mm)	-	-	23.00°C/W	Copper	Tin
577102B04000G HEATSINK TO-220 W/TAB .375" Boyd Laconia, LLC	21,002	-	RFQ	برگه مشخصات	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.375" (9.52mm)	1.0W @ 30°C	8.00°C/W @ 400 LFM	25.90°C/W	Aluminum	Black Anodized
V2017B HEATSINK ANOD ALUM CPU Assmann WSW Components	3,057	-	RFQ	برگه مشخصات	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	-	Square, Pin Fins	0.394" (10.00mm)	0.394" (10.00mm)	-	0.275" (7.00mm)	-	-	31.00°C/W	Aluminum	Black Anodized
V6560W HEATSINK ALUM ANOD Assmann WSW Components	4,885	-	RFQ	برگه مشخصات	-	Tray	Active	Board Level	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.984" (25.00mm)	1.181" (30.00mm)	-	0.472" (12.00mm)	-	-	10.00°C/W	Aluminum	Black Anodized
V-1100-SMD/B HEAT SINK COPPER DPAK TO-252 Assmann WSW Components	14,896	-	RFQ	برگه مشخصات	-	Tape & Reel (TR)	Active	Top Mount	TO-252 (DPak)	SMD Pad	Rectangular, Fins	0.320" (8.13mm)	0.790" (20.07mm)	-	0.390" (9.91mm)	-	-	25.00°C/W	Copper	Tin
287-1ABE HEATSINK FOR TO220 Wakefield-Vette	3,947	-	RFQ	برگه مشخصات	287	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	4.0W @ 65°C	7.80°C/W @ 200 LFM	16.20°C/W	Aluminum	Black Anodized
577202B00000G HEAT SINK TO-220 .500" COMPACT Boyd Laconia, LLC	11,197	-	RFQ	برگه مشخصات	-	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.500" (12.70mm)	1.5W @ 40°C	10.00°C/W @ 200 LFM	24.40°C/W	Aluminum	Black Anodized
576802B04000G HEAT SINK VERT PLUG-IN TO-220 Boyd Laconia, LLC	12,560	-	RFQ	برگه مشخصات	-	Bulk	Active	Board Level, Vertical	TO-220, TO-262	Clip and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.0W @ 30°C	7.00°C/W @ 400 LFM	27.30°C/W	Aluminum	Black Anodized
577102B00000G HEAT SINK TO-220 .375" COMPACT Boyd Laconia, LLC	778	-	RFQ	برگه مشخصات	-	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.375" (9.52mm)	3.0W @ 80°C	12.00°C/W @ 200 LFM	25.90°C/W	Aluminum	Black Anodized
110991327 HEAT SINK KIT FOR RASPBERRY PI 4 Seeed Technology Co., Ltd	22,678	-	RFQ	برگه مشخصات	-	Bulk	Active	Top Mount Kit	Raspberry Pi 4B	Adhesive	-	-	-	-	-	-	-	-	Aluminum	-
573300D00010G HEATSINK D2PAK .4" HIGH SMD Boyd Laconia, LLC	21,954	-	RFQ	برگه مشخصات	-	Tape & Reel (TR)	Active	Top Mount	TO-263 (D²Pak)	SMD Pad	Rectangular, Fins	0.500" (12.70mm)	1.030" (26.16mm)	-	0.400" (10.16mm)	1.3W @ 30°C	10.00°C/W @ 200 LFM	18.00°C/W	Aluminum	Tin
658-25AB HEATSINK CPU 28MM SQ BLK Wakefield-Vette	10,734	-	RFQ	برگه مشخصات	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
HSB05-171711 HEAT SINK, BGA, 17 X 17 X 11.5 M Same Sky (Formerly CUI Devices)	6,249	-	RFQ	برگه مشخصات	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.453" (11.50mm)	3.1W @ 75°C	8.40°C/W @ 200 LFM	23.91°C/W	Aluminum Alloy	Black Anodized
574502B03300G HEATSINK TO-220 VERT MNT W/TAB Boyd Laconia, LLC	8,221	-	RFQ	برگه مشخصات	-	Bulk	Active	Board Level, Vertical	TO-220	Clip and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.810" (20.57mm)	-	0.390" (9.91mm)	3.0W @ 60°C	6.00°C/W @ 600 LFM	21.20°C/W	Aluminum	Black Anodized
658-60AB HEATSINK CPU 28MM SQ BLK W/OTAPE Wakefield-Vette	133	-	RFQ	برگه مشخصات	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.598" (15.20mm)	2.5W @ 30°C	2.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
573100D00010G HEATSINK SMT D-PAK/TO-252 TIN Boyd Laconia, LLC	11,190	-	RFQ	برگه مشخصات	5731	Tape & Reel (TR)	Active	Top Mount	TO-252 (DPak)	SMD Pad	Rectangular, Fins	0.315" (8.00mm)	0.900" (22.86mm)	-	0.400" (10.16mm)	0.8W @ 30°C	12.50°C/W @ 600 LFM	26.00°C/W	Aluminum	Tin

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