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سینک های حرارتی

شماره قطعه تولیدکننده	موجودی	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	بسته خنک شده	روش پیوست	شکل	طول	عرض	قطر	ارتفاع باله	اتلاف نیرو @ افزایش دما	مقاومت حرارتی @ جریان هوای اجباری	مقاومت حرارتی @ طبیعی	مواد	پایان مواد
577002B00000G HEAT SINK TO-220 .250" COMPACT Boyd Laconia, LLC	11,322	-	RFQ	برگه مشخصات	-	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.250" (6.35mm)	1.5W @ 50°C	10.00°C/W @ 500 LFM	32.00°C/W	Aluminum	Black Anodized
V2022B HEATSINK CPU XCUT Assmann WSW Components	3,673	-	RFQ	برگه مشخصات	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.236" (6.00mm)	-	-	24.00°C/W	Aluminum Alloy	Black Anodized
240118ABHE22 HEATSINK TO-220 TWISTED FIN Wakefield-Vette	3,195	-	RFQ	برگه مشخصات	240	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.180" (29.97mm)	0.570" (14.47mm)	-	0.500" (12.70mm)	4.0W @ 55°C	5.30°C/W @ 400 LFM	13.80°C/W	Aluminum	Black Anodized
HSS-B20-NP-12 HEATSINK TO-220 6.8W ALUMINUM Same Sky (Formerly CUI Devices)	1,157	-	RFQ	برگه مشخصات	HSS	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.450" (36.83mm)	0.700" (17.80mm)	-	0.850" (21.60mm)	6.8W @ 75°C	3.47°C/W @ 200 LFM	14.33°C/W	Aluminum	Black Anodized
591302B02800G HEATSINK TO-220 W/INSTALL TAB Boyd Laconia, LLC	27,378	-	RFQ	برگه مشخصات	-	Bulk	Active	Board Level, Vertical	TO-220, TO-262	Clip and Board Locks	Rectangular, Fins	0.750" (19.05mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.0W @ 30°C	7.00°C/W @ 400 LFM	26.80°C/W	Aluminum	Black Anodized
V6560Y HEATSINK ALUM ANOD Assmann WSW Components	12,491	-	RFQ	برگه مشخصات	-	Tray	Active	Board Level	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.969" (50.00mm)	1.181" (30.00mm)	-	0.472" (12.00mm)	-	-	7.00°C/W	Aluminum	Black Anodized
V5629W220 HEATSINK ALUM ANOD Assmann WSW Components	5,741	-	RFQ	برگه مشخصات	-	Bulk	Active	Top Mount	TO-220	Bolt On and PC Pin	Square, Fins	0.984" (25.00mm)	0.449" (11.40mm)	-	0.260" (6.60mm)	-	-	36.00°C/W	Aluminum	Black Anodized
HSB01-080808 HEAT SINK, BGA, 8.5 X 8.5 X 8 MM Same Sky (Formerly CUI Devices)	2,653	-	RFQ	برگه مشخصات	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.335" (8.50mm)	0.335" (8.50mm)	-	0.315" (8.00mm)	1.9W @ 75°C	16.00°C/W @ 200 LFM	39.10°C/W	Aluminum Alloy	Black Anodized
V2027B HEATSINK CPU XCUT Assmann WSW Components	5,084	-	RFQ	برگه مشخصات	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.098" (27.90mm)	1.098" (27.90mm)	-	0.441" (11.20mm)	-	-	19.00°C/W	Aluminum Alloy	Black Anodized
HSB03-141406 HEAT SINK, BGA, 14 X 14 X 6 MM Same Sky (Formerly CUI Devices)	3,329	-	RFQ	برگه مشخصات	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.551" (14.00mm)	0.551" (14.00mm)	-	0.236" (6.00mm)	2.1W @ 75°C	15.80°C/W @ 200 LFM	35.98°C/W	Aluminum Alloy	Black Anodized
272-AB HEATSINK TO-220 SM FOOTPRINT BLK Wakefield-Vette	2,177	-	RFQ	برگه مشخصات	272	Bulk	Active	Board Level	TO-220, TO-202	Bolt On and PC Pin	Rectangular, Fins	1.450" (36.83mm)	1.750" (44.45mm)	-	0.375" (9.52mm)	4.0W @ 42°C	3.60°C/W @ 400 LFM	10.50°C/W	Aluminum	Black Anodized
V2020B HEATSINK CPU XCUT Assmann WSW Components	1,750	-	RFQ	برگه مشخصات	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.551" (14.00mm)	0.551" (14.00mm)	-	0.394" (10.00mm)	-	-	27.00°C/W	Aluminum Alloy	Black Anodized
V8813W HEATSINK TO-220/TOP-3/SOT-32 Assmann WSW Components	1,426	-	RFQ	برگه مشخصات	-	Tray	Active	Board Level, Vertical	SOT-32, TO-220, TOP-3	Bolt On and PC Pin	Rectangular, Fins	0.984" (25.00mm)	1.359" (34.50mm)	-	0.492" (12.50mm)	-	-	6.50°C/W	Aluminum	Black Anodized
HSB18-232310 HEAT SINK, BGA, 23 X 23 X 10 MM Same Sky (Formerly CUI Devices)	4,224	-	RFQ	برگه مشخصات	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.394" (10.00mm)	3.7W @ 75°C	6.80°C/W @ 200 LFM	20.41°C/W	Aluminum Alloy	Black Anodized
V-1100-SMD/A HEATSINK TO-263 12.70X26.20MM Assmann WSW Components	1,855	-	RFQ	برگه مشخصات	-	Tape & Reel (TR)	Active	Top Mount	TO-263 (D²Pak)	SMD Pad	Rectangular, Fins	0.500" (12.70mm)	1.031" (26.20mm)	-	0.390" (9.91mm)	-	-	23.00°C/W	Copper	Tin
HSE-B20250-040H-01 HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	1,145	-	RFQ	برگه مشخصات	HSE	Box	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Angled Fins	0.984" (25.00mm)	1.359" (34.50mm)	-	0.492" (12.50mm)	5.5W @ 75°C	4.44°C/W @ 200 LFM	13.64°C/W	Aluminum Alloy	Black Anodized
506007B00000G HEATSINK TO-3 LOW PROFILE .375" Boyd Laconia, LLC	3,540	-	RFQ	برگه مشخصات	-	Bag	Active	Board Level	TO-3	Bolt On	Rectangular, Fins	2.000" (50.80mm)	1.750" (44.45mm)	-	0.375" (9.52mm)	10.0W @ 70°C	3.00°C/W @ 400 LFM	7.00°C/W	Aluminum	Black Anodized
ATS-PCB1025 HEATSINK TO-126 BLACK Advanced Thermal Solutions Inc.	4,414	-	RFQ	برگه مشخصات	-	Bulk	Active	Board Level	TO-126	Bolt On	Rectangular, Fins	0.560" (14.22mm)	0.620" (15.75mm)	-	0.370" (9.40mm)	-	19.00°C/W @ 200 LFM	33.00°C/W	Aluminum	Black Anodized
ATS-PCB1064 HEATSINK TO-220 CLIP-ON BLACK Advanced Thermal Solutions Inc.	1,471	-	RFQ	برگه مشخصات	-	Bulk	Active	Board Level	TO-220	Clip	Rectangular, Fins	0.748" (19.00mm)	0.504" (12.80mm)	-	0.500" (12.70mm)	-	10.20°C/W @ 200 LFM	27.30°C/W	Aluminum	Black Anodized
HSB08-212106 HEAT SINK, BGA, 21 X 21 X 6 MM Same Sky (Formerly CUI Devices)	1,436	-	RFQ	برگه مشخصات	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.236" (6.00mm)	3.0W @ 75°C	9.70°C/W @ 200 LFM	25.40°C/W	Aluminum Alloy	Black Anodized

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