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خانه > محصولات > فن ها، دمنده ها، مدیریت حرارتی > حرارتی > سینک های حرارتی

سینک های حرارتی

شماره قطعه تولیدکننده	موجودی	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	بسته خنک شده	روش پیوست	شکل	طول	عرض	قطر	ارتفاع باله	اتلاف نیرو @ افزایش دما	مقاومت حرارتی @ جریان هوای اجباری	مقاومت حرارتی @ طبیعی	مواد	پایان مواد
HSB25-282810 HEAT SINK, BGA, 28.5 X 28.5 X 10 Same Sky (Formerly CUI Devices)	1,544	-	RFQ	برگه مشخصات	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.122" (28.50mm)	1.122" (28.50mm)	-	0.394" (10.00mm)	4.87W @ 75°C	5.10°C/W @ 200 LFM	15.41°C/W	Aluminum Alloy	Black Anodized
7139DG HEATSINK TO-220 TIN CLIP-ON 13MM Boyd Laconia, LLC	3,129	-	RFQ	برگه مشخصات	-	Bulk	Active	Board Level	TO-220	Clip and PC Pin	Rectangular, Fins	0.780" (19.81mm)	0.520" (13.21mm)	-	0.515" (13.08mm)	1.5W @ 50°C	8.00°C/W @ 500 LFM	28.30°C/W	Copper	Tin
531002B00000G HEATSINK TO-220 BLACK 1" Boyd Laconia, LLC	2,312	-	RFQ	برگه مشخصات	-	Box	Active	Board Level, Vertical	TO-220, TO-202	Bolt On	Rectangular, Fins	1.000" (25.40mm)	1.375" (34.93mm)	-	0.500" (12.70mm)	3.0W @ 40°C	4.00°C/W @ 400 LFM	13.40°C/W	Aluminum	Black Anodized
529802B00000G HEATSINK TO-220 10W H=1.5" BLK Boyd Laconia, LLC	8,427	-	RFQ	برگه مشخصات	-	Box	Active	Board Level, Vertical	TO-220	Bolt On	Rectangular, Fins	1.500" (38.10mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	8.0W @ 40°C	2.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
575703B00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	2,133	-	RFQ	برگه مشخصات	-	Bulk	Active	Board Level	TO-3	Bolt On	Rhombus	1.630" (41.40mm)	1.290" (32.77mm)	-	0.750" (19.05mm)	2.0W @ 30°C	4.00°C/W @ 200 LFM	13.40°C/W	Aluminum	Black Anodized
6030D(COPPER)G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	432	-	RFQ	برگه مشخصات	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	1.0W @ 20°C	6.00°C/W @ 300 LFM	12.50°C/W	Copper	Tin
V5220X HEATSINK ANOD ALUM W/PIN TO-220 Assmann WSW Components	606	-	RFQ	برگه مشخصات	-	Tray	Active	Board Level, Vertical	TO-220	Bolt On	Rectangular, Fins	1.476" (37.50mm)	1.260" (32.00mm)	-	0.787" (19.99mm)	-	-	8.00°C/W	Aluminum	Black Anodized
TGH-0130-03 ALUMINIUM HEAT SINK 35X13MM t-Global Technology	297	-	RFQ	برگه مشخصات	TGH	Bulk	Active	Top Mount	-	-	Rectangular, Fins	1.378" (35.00mm)	0.512" (13.00mm)	-	0.236" (6.00mm)	-	-	-	Aluminum	Black Anodized
ATS-PCB1074 HEATSINK TO-263 COPPER Advanced Thermal Solutions Inc.	11,043	-	RFQ	برگه مشخصات	-	Tape & Reel (TR)	Active	Top Mount	TO-263 (D²Pak)	-	Rectangular, Fins	0.500" (12.70mm)	1.031" (26.20mm)	-	0.401" (10.20mm)	-	9.50°C/W @ 200 LFM	18.00°C/W	Copper	Tin
V2277E1 CPU HEATSINK, CROSS CUT, AL6063, Assmann WSW Components	292	-	RFQ	برگه مشخصات	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.394" (10.00mm)	-	-	26.00°C/W	Aluminum Alloy	Black Anodized
576802B03100G HEAT SINK HORIZ PLUG-IN TO-220 Boyd Laconia, LLC	13,633	-	RFQ	برگه مشخصات	-	Bulk	Active	Board Level	TO-220, TO-262	Clip and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.0W @ 30°C	7.00°C/W @ 400 LFM	27.30°C/W	Aluminum	Black Anodized
625-45AB HEATSINK CPU 25MM SQ H=.45" BLK Wakefield-Vette	2,168	-	RFQ	برگه مشخصات	625	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.450" (11.43mm)	-	8.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
529701B02500G HEATSINK TO-218 SOLDER PIN Boyd Laconia, LLC	16,835	-	RFQ	برگه مشخصات	-	Bulk	Active	Board Level, Vertical	TO-218	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	12.0W @ 70°C	4.00°C/W @ 200 LFM	5.50°C/W	Aluminum	Black Anodized
M47118B011000G MAX CLIP HEATSINK Boyd Laconia, LLC	607	-	RFQ	برگه مشخصات	Max Clip System™	Bulk	Active	Board Level, Vertical	TO-126, TO-220, TO-247	Clip and PC Pin	Rectangular, Angled Fins	1.180" (29.97mm)	0.764" (19.40mm)	-	1.240" (31.50mm)	-	-	-	Aluminum	Black Anodized
HSB15-404010 HEAT SINK, BGA, 40 X 40 X 10 MM Same Sky (Formerly CUI Devices)	202	-	RFQ	برگه مشخصات	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.394" (10.00mm)	6.3W @ 75°C	3.90°C/W @ 200 LFM	11.84°C/W	Aluminum Alloy	Black Anodized
579103B00000G HEATSINK TO-3 BLACK .87" Boyd Laconia, LLC	1,075	-	RFQ	برگه مشخصات	-	Bag	Active	Top Mount	TO-3	Bolt On	Rhombus	1.540" (39.12mm)	-	1.125" (28.57mm) OD	0.870" (22.10mm)	2.5W @ 40°C	4.00°C/W @ 600 LFM	12.50°C/W	Aluminum	Black Anodized
HSS01-B20-CP HEAT SINK, STAMPING, TO-220, 49. Same Sky (Formerly CUI Devices)	975	-	RFQ	برگه مشخصات	HSS	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular	1.941" (49.31mm)	1.900" (48.26mm)	-	0.950" (24.13mm)	9.9W @ 75°C	3.70°C/W @ 200 LFM	7.59°C/W	Aluminum Alloy	Black Anodized
HSB14-353518 HEAT SINK, BGA, 35 X 35 X 18 MM Same Sky (Formerly CUI Devices)	681	-	RFQ	برگه مشخصات	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.709" (18.00mm)	8.4W @ 75°C	3.60°C/W @ 200 LFM	8.97°C/W	Aluminum Alloy	Black Anodized
TGH-0220-06 ALUMINIUM HEAT SINK 27X22MM t-Global Technology	229	-	RFQ	برگه مشخصات	TGH	Bulk	Active	Top Mount	-	-	Rectangular, Pin Fins	1.063" (27.00mm)	0.866" (22.00mm)	-	0.354" (9.00mm)	-	-	-	Aluminum	Black Anodized
534202B02853G HEATSINK TO-220 W/SHURLOCK-CLIP Boyd Laconia, LLC	19,247	-	RFQ	برگه مشخصات	-	Bulk	Active	Board Level, Vertical	TO-220	Clip and Board Locks	Rectangular, Fins	1.180" (29.97mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	1.0W @ 20°C	6.00°C/W @ 300 LFM	13.40°C/W	Aluminum	Black Anodized