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خانه > محصولات > فن ها، دمنده ها، مدیریت حرارتی > حرارتی > سینک های حرارتی

سینک های حرارتی

شماره قطعه تولیدکننده	موجودی	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	بسته خنک شده	روش پیوست	شکل	طول	عرض	قطر	ارتفاع باله	اتلاف نیرو @ افزایش دما	مقاومت حرارتی @ جریان هوای اجباری	مقاومت حرارتی @ طبیعی	مواد	پایان مواد
901-19-1-28-2-B-0 HEAT SINK ELLIP FIN 19X19MM CLIP Wakefield-Vette	192	-	RFQ	برگه مشخصات	901	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	0.748" (19.00mm)	0.748" (19.00mm)	-	1.087" (27.60mm)	-	4.91°C/W @ 200 LFM	10.30°C/W	Aluminum	Black Anodized
B-375-120-62G HEAT SINK Boyd Laconia, LLC	4,942	-	RFQ	برگه مشخصات	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
MTN-264-55 HEATSINK TO-247/TO-264 W/CLIP Wakefield-Vette	1,460	-	RFQ	برگه مشخصات	Mountain	Box	Active	Top Mount	TO-247, TO-264	Clip	Rectangular, Fins	1.060" (26.92mm)	1.740" (44.20mm)	-	1.555" (39.50mm)	-	-	-	Aluminum	Black Anodized
PA-T22-38E DUAL PIN FIN HEATSINK 2 CLIPS Ohmite	971	-	RFQ	برگه مشخصات	P	Box	Active	Board Level, Vertical	TO-220, TO-247, TO-264	2 Clips and PC Pin	Rectangular, Pin Fins	2.170" (55.12mm)	1.240" (31.50mm)	-	1.520" (38.61mm)	-	-	3.13°C/W	Aluminum	Black Anodized
ATS-54425D-C1-R0 HEAT SINK 42.5 X 42.5 X 9.5MM Advanced Thermal Solutions Inc.	120	-	RFQ	برگه مشخصات	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Fins	1.673" (42.50mm)	1.673" (42.49mm)	-	0.374" (9.50mm)	-	8.40°C/W @ 200 LFM	-	Aluminum	Black Anodized
RAS-HS-C HEATSINK RASPBERRY PI ALUM/COP Micro Connectors, Inc.	1,492	-	RFQ	برگه مشخصات	-	Retail Package	Active	Top Mount Kit	Raspberry Pi 2B, 3B, 3B+, 4B, B+	Thermal Tape, Adhesive (Included)	Rectangular, Fins; Square, Fins	-	-	-	-	-	-	-	Aluminum, Copper	-
MTN-264-27 HEATSINK TO-247/TO-264 W/CLIP Wakefield-Vette	3,978	-	RFQ	برگه مشخصات	Mountain	Box	Active	Top Mount	TO-247, TO-264	Clip	Rectangular, Fins	1.060" (26.92mm)	1.740" (44.20mm)	-	1.555" (39.50mm)	-	-	-	Aluminum	Black Anodized
ATS-12A-32-C1-R0 HEATSINK 57.9X36.83X11.43MM Advanced Thermal Solutions Inc.	283	-	RFQ	برگه مشخصات	pushPIN™	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Rectangular, Fins	2.280" (57.90mm)	1.450" (36.83mm)	-	0.450" (11.43mm)	-	21.45°C/W @ 100 LFM	-	Aluminum	Blue Anodized
OMNI-UNI-34-75 HEATSINK TO-247 TO-264 TO-220 Wakefield-Vette	672	-	RFQ	برگه مشخصات	OmniKlip™	Bulk	Active	Board Level, Vertical	TO-220, TO-247, TO-264	Clip, Solder Foot	Rectangular, Fins	2.953" (75.00mm)	1.339" (34.00mm)	-	2.953" (75.00mm)	-	-	-	Aluminum	Black Anodized
OMNI-220-18-50-2C HEATSINK 18X50MM 2-CLIP TO-220 Wakefield-Vette	978	-	RFQ	برگه مشخصات	OmniKlip™	Tray	Active	Board Level, Vertical	TO-220	Clip, Solder Foot	Rectangular, Fins	1.969" (50.00mm)	0.710" (18.03mm)	-	1.500" (38.10mm)	-	-	-	Aluminum	Black Anodized
321127B00000G HEATSINK Boyd Laconia, LLC	400	-	RFQ	برگه مشخصات	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-
OMNI-UNI-40-75-D HEATSINK TO-247 TO-264 TO-220 Wakefield-Vette	884	-	RFQ	برگه مشخصات	OmniKlip™	Bulk	Active	Board Level, Vertical	TO-220, TO-247, TO-264	Clip, Solder Foot	Rectangular, Fins	2.953" (75.00mm)	1.575" (40.00mm)	-	2.953" (75.00mm)	-	-	-	Aluminum	Black Anodized
ATS-52425B-C1-R0 HEAT SINK 42.5 X 42.5 X 7.5MM Advanced Thermal Solutions Inc.	208	-	RFQ	برگه مشخصات	maxiFLOW	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Angled Fins	1.673" (42.50mm)	1.673" (42.49mm)	-	0.295" (7.50mm)	-	4.30°C/W @ 200 LFM	-	Aluminum	Blue Anodized
ATS-H1-129-C2-R0 HEATSINK 60X60X10MM XCUT T766 Advanced Thermal Solutions Inc.	294	-	RFQ	برگه مشخصات	pushPIN™	Tray	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	2.362" (60.00mm)	2.362" (60.00mm)	-	0.394" (10.00mm)	-	8.65°C/W @ 100 LFM	-	Aluminum	Blue Anodized
ATS-06F-37-C2-R0 HEATSINK 36.83X57.6X17.78MM T766 Advanced Thermal Solutions Inc.	279	-	RFQ	برگه مشخصات	pushPIN™	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Rectangular, Fins	1.450" (36.83mm)	2.267" (57.60mm)	-	0.700" (17.78mm)	-	9.12°C/W @ 100 LFM	-	Aluminum	Blue Anodized
ATS-H1-175-C2-R0 HEATSINK 35X35X10MM R-TAB T766 Advanced Thermal Solutions Inc.	298	-	RFQ	برگه مشخصات	pushPIN™	Tray	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.394" (10.00mm)	-	13.52°C/W @ 100 LFM	-	Aluminum	Blue Anodized
RPIHS-03 RASPBERRY PI COPPER HEAT SINK OSEPP Electronics LTD	384	-	RFQ	برگه مشخصات	-	Retail Package	Active	Heat Spreader Kit, Top Mount	Raspberry Pi	Thermal Tape, Adhesive (Included)	Square, Fins; Square	-	-	-	-	-	-	-	Copper	-
RAS-FANHS10 COOLING FAN/HS - RASPBERRY PI Micro Connectors, Inc.	952	-	RFQ	برگه مشخصات	-	Retail Package	Active	Top Mount	Raspberry Pi 2B, 3B, 3B+, 4B, B+	Thermal Tape, Adhesive (Included)	Rectangular	1.969" (50.00mm)	1.181" (30.00mm)	-	0.295" (7.50mm)	-	-	-	Aluminum, Plastic	-
ATS-51290D-C1-R0 HEAT SINK 29MM X 29MM X 9.5MM Advanced Thermal Solutions Inc.	126	-	RFQ	برگه مشخصات	maxiGRIP, maxiFLOW	Bulk	Active	Top Mount	BGA	Clip, Thermal Material	Square, Angled Fins	1.142" (29.00mm)	1.142" (29.00mm)	-	0.374" (9.50mm)	-	7.40°C/W @ 200 LFM	-	Aluminum	Black Anodized
ATS-09F-40-C2-R0 HEATSINK 57.9X60.96X11.43MM T766 Advanced Thermal Solutions Inc.	300	-	RFQ	برگه مشخصات	pushPIN™	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Rectangular, Fins	2.280" (57.90mm)	2.400" (60.96mm)	-	0.450" (11.43mm)	-	14.56°C/W @ 100 LFM	-	Aluminum	Blue Anodized