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هدرها، پین های نر

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	نوع رابط	نوع تماس	زمین - جفت گیری	تعداد موقعیت ها	تعداد ردیف ها	فاصله ردیف - جفت گیری	تعداد موقعیت های بارگذاری شده	سبک	کفن زدن	نوع نصب	فسخ	نوع بست	طول تماس - جفت گیری	طول تماس - پست	طول تماس کلی	ارتفاع عایق	شکل تماس	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	تماس با پایان - ارسال	مواد تماس	مواد عایق	ویژگی ها	دمای عملیاتی	رتبه فعلی (آمپر)
SLV W 9 SMD 127 25 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 127	-	Active	Header	Male Pin	0.050" (1.27mm)	25	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 9 SMD 127 32 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	32	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 9 SMD 127 8 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	8	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 9 SMD 127 23 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	23	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 9 SMD 102 33 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 102	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	33	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 9 SMD 102 17 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 102	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	17	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 036 48 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 036	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	48	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 9 SMD 127 5 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	5	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 9 SMD 102 36 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 102	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	36	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 9 SMD 102 35 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 102	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	35	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 9 SMD 102 34 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 102	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	34	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 9 SMD 127 8 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	8	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 9 SMD 127 4 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 127	Tube	Active	Header	Male Pin	0.050" (1.27mm)	4	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 9 SMD 127 14 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	14	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 9 SMD 127 16 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	16	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 9 SMD 102 34 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 102	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	34	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 9 SMD 127 29 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 9 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	29	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 073 27 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	27	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 036 50 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 036	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	50	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 073 12 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	12	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A

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