جستجوی داغ K4FBE3D4HM-THCL ADSP-21489KSWZ-4A AD621-02E 900-13767-0030-000 MBR1045 AMS1117-3.3 0603-37-0000 NE5532P-NG T491A106M010AT 4056

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هدرها، پین های نر

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	نوع رابط	نوع تماس	زمین - جفت گیری	تعداد موقعیت ها	تعداد ردیف ها	فاصله ردیف - جفت گیری	تعداد موقعیت های بارگذاری شده	سبک	کفن زدن	نوع نصب	فسخ	نوع بست	طول تماس - جفت گیری	طول تماس - پست	طول تماس کلی	ارتفاع عایق	شکل تماس	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	تماس با پایان - ارسال	مواد تماس	مواد عایق	ویژگی ها	دمای عملیاتی	رتبه فعلی (آمپر)
SLV W 2 130 24 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	24	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 073 13 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	13	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 055 48 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	48	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	0.382" (9.70mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 036 44 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 036	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	44	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 055 58 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	58	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	0.382" (9.70mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 048 36 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	36	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 036 56 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 036	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	56	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 055 32 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	32	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	0.382" (9.70mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 073 4 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	4	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 105 36 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	36	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 22 055 20 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 22 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	20	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.197" (5.00mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 055 26 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	26	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	0.382" (9.70mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 036 38 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 036	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	38	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 073 29 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 SMD 073	Tube	Active	Header	Male Pin	0.050" (1.27mm)	29	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 073 35 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	35	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 048 33 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	33	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 048 7 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	7	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 130 12 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	12	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 073 33 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	33	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 11 105 27 Z suitable for female header BLM Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 11 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	27	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.197" (5.00mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A

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