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هدرها، پین های نر

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	نوع رابط	نوع تماس	زمین - جفت گیری	تعداد موقعیت ها	تعداد ردیف ها	فاصله ردیف - جفت گیری	تعداد موقعیت های بارگذاری شده	سبک	کفن زدن	نوع نصب	فسخ	نوع بست	طول تماس - جفت گیری	طول تماس - پست	طول تماس کلی	ارتفاع عایق	شکل تماس	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	تماس با پایان - ارسال	مواد تماس	مواد عایق	ویژگی ها	دمای عملیاتی	رتبه فعلی (آمپر)
SLV W 2 055 66 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	66	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	0.382" (9.70mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 130 66 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	66	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 080 46 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	46	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.098" (2.50mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 130 28 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	28	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 11 080 29 G suitable for female header BLM Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 11 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	29	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.197" (5.00mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 073 21 Z one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	21	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 11 080 18 G suitable for female header BLM Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 11 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	18	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.197" (5.00mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 073 30 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 SMD 073	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	30	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.287" (7.30mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 130 33 Z suitable for female header BLM Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	33	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 105 24 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	24	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 SMD 048 28 G one row, wide isolation body, 4- Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 SMD 048	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	28	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 080 16 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	16	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.098" (2.50mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 11 SMD 127 16 G pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 11 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	16	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 11 080 12 G suitable for female header BLM Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 11 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	12	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.197" (5.00mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 KA 055 11 Z suitable for female header BLM Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 KA 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	11	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	-	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 105 6 Z suitable for female header BLM Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	6	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 11 105 17 G suitable for female header BLM Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 11 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	17	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.197" (5.00mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 2 036 58 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 2 036	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	58	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Tin	157.5 ~ 236.2µin (4.00 ~ 6.00µm)	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 1 KA 080 1 G suitable for female header BLM Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 1 KA 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	1	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.098" (2.50mm)	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A
SLV W 11 SMD 127 18 G pitch 1.27 x 2.54 mm; two rows, Fischer Elektronik	-	RFQ	برگه مشخصات	SLV W 11 SMD 127	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	18	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Gold	7.87µin (0.200µm)	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-40°C ~ 163°C	1.5A

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