سوکت های آی سی

شماره قطعه تولیدکننده	قیمت	تعداد	برگه مشخصات	سری	بسته بندی	وضعیت محصول	تایپ کنید	تعداد موقعیت ها یا پین ها (شبکه)	زمین - جفت گیری	تماس با پایان - جفت گیری	ضخامت پایان تماس - جفت گیری	مواد تماس - جفت گیری	نوع نصب	ویژگی ها	فسخ	زمین - پست	تماس با پایان - ارسال	تماس با ضخامت پایان - پست	تماس با مواد - پست	مصالح مسکن	دمای عملیاتی
540-88-028-17-400-TR CONN SOCKET PLCC 28POS TIN Preci-Dip	-	RFQ	برگه مشخصات	540	Tape & Reel (TR)	Obsolete	PLCC	28 (4 x 7)	0.050" (1.27mm)	Tin	-	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-
116-87-308-41-002101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
1814642-1 CONN IC DIP SOCKET 4POS GOLD TE Connectivity AMP Connectors	-	RFQ	برگه مشخصات	-	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass	Thermoplastic, Polyester	-55°C ~ 125°C
110-87-314-41-105101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
A-ICS-254-06-TT50 IC SOCKET, MACHINED PIN, 7.62MM, Assmann WSW Components	-	RFQ	برگه مشخصات	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6	0.100" (2.54mm)	Nickel	78.7µin (2.00µm)	Beryllium Copper	Through Hole, Right Angle	Open Frame	Solder	0.100" (2.54mm)	Tin	78.7µin (2.00µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
116-87-610-41-012101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	116	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
614-87-312-31-012101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	614	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
DIP624-001B DIP624-001B-DIP SOCKET 24 CTS Amphenol ICC (FCI)	-	RFQ	برگه مشخصات	-	Bag	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
06-3518-00 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	-	RFQ	برگه مشخصات	518	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
A-CCS 020-Z-SM/T IC SOCKET, CHIP CARRIER, 1.27MM, Assmann WSW Components	-	RFQ	برگه مشخصات	-	Tape & Reel (TR)	Active	PLCC	20	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-40°C ~ 105°C
110-83-314-41-001101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
SIP1X10-041B SIP1X10-041B-SIP SOCKET 10 CTS Amphenol ICC (FCI)	-	RFQ	برگه مشخصات	SIP1x	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
116-83-308-41-003101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
A24-LCG-T-R CONN IC DIP SOCKET 24POS GOLD Assmann WSW Components	-	RFQ	برگه مشخصات	-	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	-	-	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	-	-	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
116-87-304-41-013101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AR16-HZW/T CONN IC DIP SOCKET 16POS GOLD Assmann WSW Components	-	RFQ	برگه مشخصات	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
110-83-312-01-680101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6), 6 Loaded	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
114-83-312-41-117101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
114-83-312-41-134161 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	-	RFQ	برگه مشخصات	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
DIP632-014B DIP632-014B-DIP SOCKET 32 CTS Amphenol ICC (FCI)	-	RFQ	برگه مشخصات	-	Bag	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-