لطفاً برای دریافت آخرین قیمت‌ها و موجودی با ما تماس بگیرید.

سوکت های آی سی

عکس شماره قطعه تولیدکننده موجودی قیمت تعداد برگه مشخصات سری بسته بندی وضعیت محصول تایپ کنید تعداد موقعیت ها یا پین ها (شبکه) زمین - جفت گیری تماس با پایان - جفت گیری ضخامت پایان تماس - جفت گیری مواد تماس - جفت گیری نوع نصب ویژگی ها فسخ زمین - پست تماس با پایان - ارسال تماس با ضخامت پایان - پست تماس با مواد - پست مصالح مسکن دمای عملیاتی
2-1571551-3

2-1571551-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0
RFQ
2-1571551-3

برگه مشخصات

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AR20-HZL/07-TT

AR20-HZL/07-TT

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

0
RFQ
AR20-HZL/07-TT

برگه مشخصات

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
08-2513-10T

08-2513-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0
RFQ
08-2513-10T

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-4513-10T

08-4513-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0
RFQ
08-4513-10T

برگه مشخصات

Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
04-0518-11H

04-0518-11H

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0
RFQ
04-0518-11H

برگه مشخصات

518 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
04-1518-11H

04-1518-11H

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

0
RFQ
04-1518-11H

برگه مشخصات

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
09-0518-10H

09-0518-10H

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0
RFQ
09-0518-10H

برگه مشخصات

518 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0104-TT-12

HLS-0104-TT-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0104-TT-12

برگه مشخصات

HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
540-99-032-17-400000

540-99-032-17-400000

CONN SOCKET PLCC 32POS TIN-LEAD

Mill-Max Manufacturing Corp.

0
RFQ
540-99-032-17-400000

برگه مشخصات

540 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
110-87-422-41-005101

110-87-422-41-005101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0
RFQ
110-87-422-41-005101

برگه مشخصات

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-422-41-605101

110-87-422-41-605101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0
RFQ
110-87-422-41-605101

برگه مشخصات

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ED052PLCZ-SM-N

ED052PLCZ-SM-N

CONN SOCKET PLCC 52POS

On Shore Technology Inc.

0
RFQ
ED052PLCZ-SM-N

برگه مشخصات

ED Tube Active PLCC 52 (2 x 26) 0.050" (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 105°C
612-83-310-41-001101

612-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0
RFQ
612-83-310-41-001101

برگه مشخصات

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A-CCS 052-Z-SM

A-CCS 052-Z-SM

CONN SOCKET PLCC 52POS TIN

Assmann WSW Components

0
RFQ
A-CCS 052-Z-SM

برگه مشخصات

- Tube Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled -40°C ~ 105°C
SIP050-1X12-160B

SIP050-1X12-160B

1X12-160B-SIP SOCKET 12 CTS

Amphenol ICC (FCI)

0
RFQ
SIP050-1X12-160B

برگه مشخصات

SIP050-1x Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
540-99-020-17-400000

540-99-020-17-400000

CONN SOCKET PLCC 20POS TIN-LEAD

Mill-Max Manufacturing Corp.

0
RFQ
540-99-020-17-400000

برگه مشخصات

540 Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
540-99-020-17-400200

540-99-020-17-400200

CONN SOCKET PLCC 20POS TIN-LEAD

Mill-Max Manufacturing Corp.

0
RFQ
540-99-020-17-400200

برگه مشخصات

540 Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
115-87-318-41-003101

115-87-318-41-003101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0
RFQ
115-87-318-41-003101

برگه مشخصات

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
0787250002

0787250002

CONN CAMERA SOCKET 18POS GOLD

Molex

0
RFQ
0787250002

برگه مشخصات

78725 Tray Obsolete Camera Socket 18 (2 x 9) - Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Closed Frame Solder - Gold Flash Copper Alloy Thermoplastic -30°C ~ 85°C
110-87-324-41-001151

110-87-324-41-001151

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0
RFQ

-

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
Total 19086 Record«Prev1... 114115116117118119120121...955Next»

همین حالا شروع کنید!

دریافت آخرین اخبار

EASTECH Electronics

خانه

EASTECH Electronics

جستجو

EASTECH Electronics

محصولات

EASTECH Electronics

Whatsapp

در حال ارسال...
×
با موفقیت ارسال شد!
از ارسال شما سپاسگزاریم، تیم فروش ما درخواست شما را دریافت خواهد کرد و ظرف ۱۲ ساعت با ارائه قیمت با شما تماس خواهیم گرفت.